Capabilities Matrix

PRECISION
DELIVERED.

Hardware design and manufacturing coordination, from first sketch to volume production. Every service built around getting your product to market reliably.

developer_board
01 // LAYOUT

PCB Design & Layout

Multi-layer signal integrity focused layouts. Differential pair routing, impedance matching, and EMI/EMC mitigation for demanding applications.

  • chevron_right Up to 16 Layer Boards
  • chevron_right GHz Range Signal Integrity
  • chevron_right Rigid-Flex Assemblies
  • chevron_right IPC-A-610 Class 3 Standards
Capabilities
Layer Count Up to 16
Frequencies GHz Range
Min Trace 3 mil
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02 // BUILD

Product Prototyping

From schematic to working hardware. Simple 2-layer boards in 2–3 weeks; complex multi-layer designs 4–8 weeks including PCB fabrication lead times. We handle component sourcing, DFM assessment, and first-article validation.

Turnaround 2–8 Weeks
BOM Sourcing Included
Testing First Article
PCB prototype
03 // PRODUCTION

Manufacturing & DFM

Production coordination through our trusted manufacturing partners. Design for Manufacturability review, SMT assembly oversight, and quality assurance from prototype to scale.

SMT Assembly X-Ray Inspection BOM Management Partner Network
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04 // ADVISORY

Hardware Consulting

Technical guidance for hardware teams. Architecture review, component selection, thermal analysis, and production readiness assessment. We help you make the right decisions early.

architecture Architecture Review
thermostat Thermal Analysis
checklist Readiness Audit
05 // CODE

Software & Firmware

We write the software that runs on your hardware. From bare-metal microcontroller firmware to full embedded Linux BSP development, device drivers, and application-layer code. Your product isn't done when the PCB works — it's done when the whole system works.

Embedded Linux BSP Development RTOS / Bare-Metal Device Drivers OTA Updates Communication Stacks
// firmware_main.c
#include "nitra_hal.h"
#include "drivers/spi.h"
 
int main(void) {
hal_init();
spi_configure(SPI_MODE_3);
sensor_start();
while(1) {
process_data();
transmit_packet();
}
}
0
Design Accuracy
2–8wk
Prototype Turnaround
0
Max PCB Layers
0
Quote Response